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[Analysis Case] Non-destructive 3D Structural Observation of SiC Discrete Packages

Non-destructive three-dimensional observation of the internal structure of a discrete package.

In investigations of competitor products and inspections of defective items, an internal structural examination is necessary first. X-ray CT allows for non-destructive acquisition of transmission images from within the sample, enabling three-dimensional reconstruction. This document presents a case study where a discrete package equipped with SiC chips was observed using X-ray CT as part of a product investigation. After confirming the structure with X-ray CT, we propose conducting physical analysis (failure analysis) using MST.

• Company：一般財団法人材料科学技術振興財団　MST
• Price：Other

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